Ultra Low Oxygen Glove Box System

BX128(A)-N2

Low Oxygen Nitrogen Glove Box (<1 ppm),Inert Atmosphere Glove Box for Semiconductor Process,Anti-Oxidation Nitrogen Glove Box,

The Ultra Low Oxygen Glove Box System is designed to create a stable oxygen-free working environment, achieving O₂ levels below 1 ppm through high-purity nitrogen purging technology. This effectively minimizes material oxidation and experimental errors while integrating precise humidity control to ensure a stable and reliable micro-environment. It is widely used in lithium battery material research, semiconductor manufacturing, and advanced material processing to enhance process consistency and product quality. The system also supports modular customization, including integration with vacuum systems, CDA (clean dry air), and ESD protection, meeting the efficiency and safety requirements of high-precision industries.

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You will need an Ultra-Low Oxygen Glove Box System (<1 ppm) in the following scenarios:

✔ When materials are prone to oxidation (e.g., lithium batteries, metal materials)
✔ When processes require low-oxygen or oxygen-free environments
✔ When experiments demand high stability and reproducibility
✔ When operations must be isolated from moisture and external contamination

High-Purity Inert Environment, Effectively Isolating Oxygen and Moisture
The Ultra Low Oxygen Glove Box System (<1 ppm) utilizes high-purity nitrogen to continuously purge the internal atmosphere, maintaining oxygen and moisture levels at extremely low concentrations (<1 ppm). This creates a stable inert environment, functioning as both an Inert Atmosphere Glove Box and a Nitrogen Glove Box System. As an Anti-Oxidation Glove Box and Moisture & Oxygen Controlled Glove Box, it effectively protects oxidation-prone, hygroscopic, and highly sensitive materials. It is widely used as a Glove Box for Semiconductor, Glove Box for Lithium Battery, and Glove Box for Sensitive Materials, making it ideal Oxygen Free Environment Equipment for high-demand applications.

Stable Oxygen and Humidity Control for Reliable Reproducibility
The Ultra Low Oxygen Glove Box System (<1 ppm) is equipped with an advanced monitoring and control system, integrating high-precision sensors and circulation purification modules. This Low Oxygen Glove Box (<1 ppm) ensures real-time monitoring and precise environmental adjustment, minimizing particle and moisture interference. As a Moisture & Oxygen Controlled Glove Box, it guarantees consistent operating conditions, significantly improving experimental stability and reproducibility.

Flexible Modular Design for Diverse Process Integration
The Ultra Low Oxygen Glove Box System (<1 ppm) supports flexible integration of transfer chambers, vacuum systems, heating/cooling modules, and ESD protection. Designed as a scalable Nitrogen Glove Box System, it can be configured into an advanced Inert Atmosphere Glove Box with sterile and clean environment capabilities. This enables multi-stage processes—from material preparation, packaging, and testing to temporary storage—while enhancing operational efficiency and safety.

Features

Precise Humidity Control:Equipped with a high-efficiency humidity control system, the unit maintains a stable dry air environment with precise control from 1% to 60% RH, effectively preventing moisture absorption and material degradation.
Low-Humidity Operating Environment:Provides a consistently low-humidity environment, ideal for moisture-sensitive experiments and material handling, ensuring stable dry conditions throughout operations.
High-Performance Sealing Design:Features a premium sealing system that prevents external moisture ingress, ensuring internal air stability and minimizing the impact of environmental fluctuations.
High-Quality Glove Operation System:Equipped with durable and flexible gloves, allowing operators to perform tasks freely within a sealed environment while avoiding contamination and external exposure.
Clean Environment Protection:Designed for high-precision applications requiring clean and dry conditions, effectively preventing external contaminants from affecting sample quality and experimental results.
Versatile Applications:Widely applicable in semiconductor processes, chemical laboratories, material research, and biotechnology, meeting diverse environmental control requirements.
User-Friendly Operation & Maintenance:Simple and intuitive design ensures easy operation and maintenance, supporting long-term stable use while reducing operational and maintenance costs.
Scalability & Customization:Available in various models and configurations, with customizable internal structures and functions to meet different application and environmental needs.

Application

Widely Applied in High-Precision Industries:
Semiconductor manufacturing processes and photomask-related applications
Lithium battery material R&D and manufacturing
Chemical synthesis and handling of sensitive materials
Biotechnology and sterile laboratory operations

Benefit

Stable Low-Oxygen & Humidity-Controlled Micro-Environment:Continuous purging with high-purity nitrogen maintains oxygen and moisture at extremely low levels (<1 ppm), effectively preventing oxidation and moisture absorption while ensuring stable operation.
Real-Time Monitoring & Precision Control System:Equipped with high-precision sensors and control modules for real-time monitoring of oxygen and humidity levels, ensuring consistent operating conditions and improving process repeatability and reliability.
Modular Design for Flexible Integration:Supports integration with vacuum systems, heating modules, and electrostatic discharge (ESD) protection, enabling customization to meet diverse process and application requirements.

Key Performance Overview:

✔ Oxygen Concentration: <1 ppm
✔ Humidity Control Range: 1% – 60% RH
✔ Operating Environment: Oxygen-free / Low-humidity stable conditions
✔ Control System: Real-time monitoring with alarm functions

Product Specifications

Model	Ultra Low Oxygen Glove Box System(<1 ppm) BX128(A)-N2
Control Module	Nitrogen Controlled Atmosphere
Humidity Control Range	1% - 60%RH
External Dimensions (mm)	W700 x D600 x H500
Internal Dimensions (mm)	W680 x D470 x H480
Box Material	Transparent Acrylic
Door Opening Size (mm)	W350 x H350
Storage Opening Size (mm)	W300 x H300
Glove Sleeve Size (mm)	Ø 150
Humidity Display	0% RH ~ 99.9% RH
Temperature Display	1 ~ 60°C
Voltage	100 ~ 240VAC ; 50/60Hz

Nitrogen Controller

Model	Slim Nitrogen Control Unit FN2HT	Slim Nitrogen Control Unit (flow meter equipped) FN2HT-FM	Standard Nitrogen Control Unit N2HT	Nitrogen Control Unit (Oxygen monitoring equipped) N2HTO
External Dimensions (mm)	W260 x H84 x D300	W300 x H120 x D235	W315 x H257 x D220	W315 x H337 x D220
Intake Pressure	CDA or nitrogen, 3 kg/cm² to 9 kg/cm²	CDA or nitrogen, 3 kg/cm² to 9 kg/cm²	Nitrogen, 3kg / cm² ~ 9kg / cm²	Nitrogen, 3kg / cm² ~ 7kg / cm²
Display Screen Numbers	0.5" LEDDigits	0.5" LEDDigits	2.3" LEDDigits	2.3" LEDDigits
Humidity Control Range	Adjustable from 1%RH ~ 60%RH	Adjustable from 1%RH ~ 60%RH	Adjustable from 1%RH ~ 60%R	Adjustable from 1%RH ~ 60%RH
Humidity Display	0.0%RH ~ 99.9%RH	0.0%RH ~ 99.9%RH	0.0%RH ~ 99.9%RH	0.0%RH ~ 99.9%RH
Temperature Display	0.0°C ~ 60.0°C	0.0°C ~ 60.0°C	0.0°C ~ 60.0°C	0.0°C ~ 60.0°C
Temperature Accuracy	± 1°C (0 ~ 60°C)	± 1°C (0 ~ 60°C)	± 1°C (0 ~ 60°C)	± 1°C (0 ~ 60°C)
Power Consumption	16W	16W	20W	25W
Oxygen Concentration Display Range				0.1% ~ 25%
Oxygen Concentration Accuracy				± 0.2% (0 ~ 25%)

Gallery

Nitrogen Glove Box provides a clean environment for precision tasks like microscopy, SMD processing, and mold assembly.
Nitrogen Glove Box ensures precision in semiconductor, crystal, and optics processing.
Nitrogen Glove Box is designed for lab processing, offering dust-proofing and adjustable humidity control.
Nitrogen Glove Box can be custom-sized for single or multi-user use, providing optimal workspace.

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