● Material Thawing System
Bossmen's thawing system precisely controls the material thawing process, ensuring that materials reach the required optimal temperature during thawing. When the temperature reaches the preset thawing range, the system will automatically alert to prevent exceeding the range, avoiding material spoilage.
● Smart Freezing Control System
The freezing system uses precise temperature control technology to maintain materials in a low-temperature environment, while also monitoring humidity changes to prevent moisture ingress, ensuring the integrity of materials during storage.

In the semiconductor industry, thawing and freezing materials are primarily used to prevent damage to material properties caused by temperature or humidity fluctuations, ensuring that they reach optimal conditions for use. Below are common thawing/freezing materials in the semiconductor industry:
1. Solder Paste
Solder paste needs to be stored in a low-temperature environment to prevent premature curing or clumping before use. The thawing process must be precisely controlled to avoid damage to its properties.
2. Dry Film
Dry film is a photoresist material stored in low-temperature environments and needs to be thawed before use to ensure it is not affected by external environmental conditions during the exposure process.
3. PP (Polypropylene) Material
Polypropylene is commonly used for packaging materials or substrates. Storing it at temperatures that are too high or too low can affect its mechanical properties, requiring proper thawing control.
4. Ink
Inks used in semiconductor processes (such as printed circuit board inks) must also be stored in a low-temperature environment to avoid overheating, which can impact color stability and flow properties. Thawing is necessary before use.
5. Copper Foil
Copper foil, an essential material in printed circuit board (PCB) manufacturing, is very sensitive to temperature and humidity. Controlling environmental conditions during storage and transportation is crucial.
6. Solder Balls
Solder balls are widely used in semiconductor packaging and must be stored in a low-temperature environment to prevent premature oxidation or deformation.
7. Conductive Adhesive
Conductive adhesive used for semiconductor packaging and connections needs to be stored in a low-temperature environment and thawed before use to ensure its adhesion and conductivity properties are maintained.
8. Electronic Components
Electronic components like resistors, capacitors, and diodes require controlled storage environments to prevent damage from moisture or extreme temperatures.
These materials require special attention to thawing and freezing control during the semiconductor production process to ensure their physical properties and performance are not compromised due to improper storage conditions.